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DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs 25in (32mm)

SKU: 8846125726

4.7
USD175.00 USD197.00

Pay in 4 interest-free payments of $43.75 Learn more

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Ships within 48 hours · Estimated delivery Aug 5 - Aug 10

Description

25in (32mm)

Applications: Wide range of materials

Particle Size: 3 Micron

Quantity: 1/pkg

ProPrep Colloidal Silica is an excellent metallographic final polishing suspension for removing the final layer of surface deformation in materials such as steels

DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs 25in (32mm)The DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 6in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 6in (150mm) Thickness: 0. 024in (0. 6mm) Arbor: 0. 5in (12. 7mm) Item No DS 1006 1 pkg

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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